Standard JEDEC IC Tray for LGA Type Essential in Semiconductor Packaging Process

Product Description:

Standard JEDEC IC TRAY Commonly Used In The Manufacturing Process Of Semiconductor Packaging Companies

Made from high-quality materials, our trays are durable and long-lasting. They have a tray weight of 120~200g, making them lightweight and easy to handle. Whether you are using an Apple Tray Making Machine or manually packaging your ICs, our Jedec IC Trays are the perfect choice. They are designed to fit perfectly into cardboard box trays, making them a versatile and convenient packaging solution.

With our JEDEC IC Trays, you can be confident that your ICs are well-protected during packaging and transport. They are the perfect choice for any company that wants to ensure the safe and secure delivery of their electronic components ICs. Order yours today and experience the difference that our Jedec IC Trays can make!

Technical Parameters:

These technical parameters are for the Jedec IC Trays product, which is commonly used for Electronic Components IC Chips and Electronic Components ICs packaging. The tray is rectangular in shape, stackable, and has a size of 322.6*135.9mm. It has a surface resistance of 1.0*10e4-1.0*10e11Ω and is made of MPPO.PPE.ABS.PEI.IDP material in black color. The tray can accommodate BGA,QFP,QFN,LGA,PGA IC Types and has a weight of 120~200g. The tray is typically used in Cardboard Box Trays for IC packaging and has a height of 7.62mm.

Support and Services:

Our product technical support and services for the Jedec IC Trays include:

- Expert advice on product selection and customization

- Comprehensive training on proper handling and usage of the trays

- On-site technical support and troubleshooting

- Repairs and maintenance services for damaged trays

- Customized packaging and labeling options for easy identification and tracking

- Fast and efficient delivery options to ensure timely arrival of products