Optoelectronic Components Packaging Trays Bare Die
Durable Antistatic ABS Bare Die Tray With Different Size For Optoelectronic Components
Hiner pack designs trays for any type of component, module, MEMS, or device, and it need not be in a JEDEC format. Working with application requirements, engineering principles, materials technology, and manufacturing best practices, a custom solution may be the best value for your business.
Custom molded tray will develop a custom pocket design to handle and protect your sensitive and micro devices. Trays are then CNC machined to the specific configuration for your part.
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.
| HN2069 Technical Data Ref. |
| Base Information |
Material |
Color |
Matrix QTY |
Pocket Size |
| PC |
Black |
10*10=100PCS |
1.4*1.4*0.26mm |
| Size |
Length * Width * Height (according to customer's requirement) |
| Feature |
Durable;Reusable;Rcofriendly;Biodegradable |
| Sample |
A. The free samples: choosen from existing products. |
| B. customized samples as per your design/demand |
| Accessory |
Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format |
PDF,2D,3D |
| Outline Size |
Material |
Surface Resistance |
Service |
Flatness |
Color |
| 2" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.2mm |
Customizable |
| 3" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.25mm |
Customizable |
| 4" |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
Max 0.3mm |
Customizable |
| Custom size |
ABS.PC.PPE...etc |
1.0x10e4-1.0x10e11Ω |
OEM,ODM |
TBC |
Customizable |
| Provide professional design and packaging for your products |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
FAQ
Q1. Why Choose us?
Wallis insist strict QC during producing, product performance are ensured.
Strong technical team-quick to solve problems, creative to design new items, latest RFID items .
Big capacity-cost-effective and flexible to adjust production for volume and urgent orders.
10-year factory experienced in all crafts, and with strong customization capacity, satisfy your requirement to the best.
Having long-term and stable material suppliers, sources are trust-able and time-effective.
Owning professional agents of shipping. Goods reach to you fast, save and cost-effective.
Q2. Can I order if quantity less than MOQ?
Yes and it would be taken as sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.
Q4. Do you arrange shipment for the products?
It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
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